After announcing the Dimensity 9000 last November, MediaTek expands its line of flagship chips with the Dimensity 8000 and 8100. Aimed to rival the Snapdragon 888, the Dimensity 8000 and 8100 are manufactured using TSMC’s 5nm process and feature four Cortex-A78 cores and four Cortex-A55 cores.

The Cortex-A78 cores on the Dimensity 8000 run at 2.75Ghz, while on the Dimensity 8100, they run at 2.85Ghz.

Save for the difference in the clock speed for the performance cores, the Dimensity 8000 and 8100 come with a Mali-G610 MC6 GPU, and support for LPDDR5 RAM and UFS 3.1 storage. They also use MediaTek’s HyperEngine 5.0 for optimal performance with gaming.

The Imagiq 780 ISP found on both processors supports up to 200-megapixel cameras, 14-bit color, and 4K60 HDR10+ video recording, and up to 168hz for Full HD+ displays (up to 120hz for WQHD+ displays for the Dimensity 8100). Both chips have a 5G modem that supports sub-6Ghz frequencies, along with support for WiFi 6E and Bluetooth 5.3.

Aside from the Dimensity 8000 and 8100, MediaTek also announced the Dimensity 1300, which has an updated ISP that supports 200-megapixel cameras, along with the chipmaker’s HyperEngine 5.0. The Dimensity 1300 has one Cortex-A78 ultra core running at 3Ghz, three Cortex-A78 super cores, and four Cortex-A55 cores, along with a Mali-G77 GPU.

MediaTek said that all three processors will be available by the first quarter of 2022, which means it will not be long until we get to see a phone using any of the three processors.