Xiaomi may have confirmed the 13 Ultra for a possible launch this month, but its design remains to be a mystery. While we’re waiting for official details, speculative renders of the Xiaomi 13 Ultra have surfaced, and the main highlight has to be that huge camera bump in the back–one that’s even bigger than the one on the 12s Ultra.

According to the measurements based on the Xiaomi 13 Ultra’s alleged CAD design, the total thickness of the phone with the camera bump is 15.61mm and 9.57mm with just the phone itself. That’s around 6mm of thickness for the camera bump alone. For comparison, the 12s Ultra is 9.1mm thin for the phone alone, and 13.5mm with the camera bump.

According to measurements from the CAD design, the phone measures 163.2 x 74.6 x 9.57mm, without the bump. With the bump the total thickness comes out to 15.61mm. For comparison, the 12S Ultra is 9.1mm without the bump and 13.5mm with it.

With the Xiaomi 13 Ultra expected to be a huge phone because of having four 50-megapixel cameras (one of them being a 1-inch sensor), it appears to have a more subtle camera back design than the 12s Ultra based on the speculative renders. The texture on the back panel does hint at a possible vegan leather model, and the slope towards the camera module further confirms that Xiaomi needed to place a thick bump for the 13 Ultra to accommodate its four 50-megapixel cameras.

Expected specs of the Xiaomi 13 Ultra include a Snapdragon 8 Gen 2 processor, a 120hz Curved AMOLED display with a 2K resolution, and a 4900mAh battery that will support 90w wired and 50w wireless charging.

The Xiaomi 13 Ultra is confirmed to be made available globally, though it remains to be seen how many countries will be able to get their hands on one. As for pricing, the Xiaomi 13 Ultra is rumored to start at CNY 6299(~Php 50.4k) for the 8GB/256GB model, with the 16GB/512GB version expected to be priced at CNY 7499(~Php 60k).

We should know more about the Xiaomi 13 Ultra once it gets officially unveiled on April 18.