With a number of flagship and mid-range processors using a 4nm process, MediaTek announced that they are working with TSMC for a flagship Dimensity processor that utilizes a 3nm process. Compared to the N5 process of TSMC, its  3nm process offers as much as 18% speed improvement at same power, or 32% power reduction at same speed, and approximately 60% increase in logic density. 

“TSMC’s consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market,” MediaTek President Joe Chen said.  

This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC, with both companies taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.

“Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond,“ TSMC Senior Vice President of Europe and Asia Sales Dr. Cliff Hou said.

MediaTek adds that the first flagship Dimensity processor that will be built on TSMC’s 3nm process will be available to  smartphones, tablets, intelligent cars and various other devices starting in the second half of 2024.