Qualcomm should be worried in the mid-range segment, as MediaTek announced the Dimensity 8300, which appears to be better than the Snapdragon 7 Gen 3 (and even the Snapdragon 7+ Gen 2) on paper.
The most obvious part where the Dimensity 8300 shines is its 1/3/4 CPU layout, where its Cortex-A715 Prime Core runs at 3.35 GHz. That’s as high as what you get on the higher-clocked version of the Snapdragon 8 Gen 2–though Qualcomm’s 2023 flagship chip uses a Cortex-X3 prime core instead. The Dimensity 8300’s other 3 Cortex-A715 cores run at 3.0 GHz, which is the same as the Dimensity 8200.
Just like every Dimensity 8000-series chip since the 8100 (and not including the 8050 and 8020, which are rebranded processors), MediaTek is positioning them as processors meant for budget flagships. To leverage on that, one of the main features of the Dimensity 8300 is its support for Generative AI–which is a first for a non-flagship chip.
Aside from the powerful CPU, MediaTek claims that the Dimensity 8300’s Mali-G615 GPU is 60% better than the GPU found on the Dimensity 8200, which should make MediaTek’s new mid-range chip at par with Qualcomm’s older flagship chips like the Snapdragon 8+ Gen 1. Speaking of flagship features, the Dimensity 8300 supports LPDDR5X RAM and UFS 4.0 storage.
Given our positive reception with the Dimensity 8100, we’re excited at what the Dimensity 8300 has to offer. Xiaomi confirmed that the Redmi K70e will debut MediaTek’s new mid-range chip, and we expect the China-only phone to debut globally as a POCO device.
