With the announcement of the Dimensity 9000 and its all-new 4nm architecture, MediaTek is flexing its muscles for flagship processors–on top of dominating the chip market share for 2021. While MediaTek used to be plagued with heating and throttling issues with its older chips (like the Helio X20), the Taiwanese chipmaker claims that it is confident with the thermal management of the Dimensity 9000.

“There’s only one company having issues with heating right now. And it’s not us,” Mediatek global PR director Kevin Keating said to Android Authority. “The competitor likes to toss that around at Mediatek, but we have not had heating issues.”

MediaTek’s statement points to Qualcomm, following early reports of overheating and throttling issues on the Snapdragon 888. While it does throttle later than the Exynos 2100 based on tests made by other media outlets, the throttling and heating problem is pointed against Samsung’s 5nm process–which is said to be inferior to TSMC’s 5nm process that is used on Apple and Huawei processors.

With the Dimensity 9000 being based on TSMC’s 4nm process, MediaTek Vice President and General Manager of Marketing told Android Authority that it is confident with the performance of the Dimensity 9000 against other upcoming flagship chips. “I think what I would say is we’re very confident, and obviously we’re sampling this chip to our major customers and the feedback we’re getting is quite promising as well.”

While the key features of the Dimensity 9000, which includes the use of Cortex-X2, Cortex-A710, Cortex-A510 CPU cores and a Mali-G710 GPU, sound very promising on paper, we will have to see actual performance benchmarks if MediaTek’s claims are true.

Our recent tests show that the Dimensity 1200, MediaTek’s most powerful chip available right now, slots in below the Snapdragon 870 in synthetic benchmarks and real-life performance.