While we just got the Xiaomi 13T series last month, Xiaomi is preparing for the premium flagship 14 series in China in a few days’ time–specifically on October 26. As we wait for the unveiling, here are a few things we know about the Xiaomi 14 series:
The launch is a day after the alleged Snapdragon 8 Gen 3 unveiling. The launch date appears to be planned all along, as Qualcomm will be holding this year’s Snapdragon Summit from October 24 to 26. By tradition, this is the time that Qualcomm will unveil its latest flagship processor–in this case, it will most likely be called Snapdragon 8 Gen 3. Given the date of the unveiling of the 14 series, Xiaomi wants to be the first brand to use Qualcomm’s latest chips.
According to early Geekbench results, the Xiaomi 14 is 20% better in multi-core and 5% better in single-core compared to the Xiaomi 13. As for the Snapdragon 8 Gen 3’s design, it will have a Cortex-X4 core running at 3.30 GHz, three Cortex-A720 cores running at 3.15Ghz, two Cortex-A720 cores running at 2.96Ghz, and two Cortex-A520 cores running at 2.7Ghz.
It still has a large camera module. Alleged renders of the Xiaomi 14 Pro reveal that it might settle for a flat display given its flat frame sides. Also worth noting is the camera module, which appears to be bigger than the Xiaomi 13 Pro and has four cameras instead of three. The renders do not reveal the Leica brand, but we expect the Xiaomi 14 series to keep the branding on the device.
It will debut HyperOS. Xiaomi is replacing MIUI with HyperOS, which is said to unify all devices and applications under the Xiaomi ecosystem. It’s not clear how HyperOS will be different from MIUI, but early screenshots reveal that both UIs will look almost similar. Xiaomi claims that HyperOS has a revamped architecture, though we will have to see how it will be implemented starting with the Xiaomi 14 series.
That’s all we know about the upcoming Xiaomi 14 series. We look forward to any surprises the brand has in store–especially with how HyperOS will be an evolution of MIUI.
