One of them to use an 8nm process
Following its announcement at MWC 2018, new details of Qualcomm’s Snapdragon 700-series chips have surfaced in this latest leak.
According to the spec sheet, the first SoC under the Snapdragon 700 line is the Snapdragon 710 and Snapdragon 730. The former will be manufactured using a 10nm LPE process by Samsung, while the latter utilizes an 8nm LPP process—the smallest manufacturing process to date.
Reports also note that the Snapdragon 710 is a rebranded Snapdragon 670, and will be used by Xiaomi in its upcoming phones.
Differences between the two processors include Kryo 300-series cores and Spectra 250 ISP for the Snapdragon 710, and Kryo 400-series cores, Spectra 350 ISP, and a dedicated NPU for the Snapdragon 730. Common specs include support for 4K60 HEVC video, WQHD+ displays, up to a 32-megapixel single camera setup, and an Adreno 615 GPU.
Both SoCs are expected to be available by the end of the year.
