Upcoming Qualcomm Snapdragon SoC Spec Sheet Leaked

Upcoming Qualcomm Snapdragon SoC Spec Sheet Leaked

All SoCs to be using Kryo Cores

Following reports that Qualcomm is working on the Snapdragon 670, a leaked spec sheet reveals that the San Diego-based company is working on four SoCs for 2018: Namely the Snapdragon 845, the Snapdragon 670, the Snapdragon 640, and the Snapdragon 460.

All four SoCs will be using Kryo cores, with the 845 using Kryo 385 cores, the 670 using a mix of Kryo 385 and 360 c0res, and the 640 and 460 using Kryo 360 cores. Save for the 460, which is made using the 14nm LPP process, all of Qualcomm’s upcoming SoCs will be made using the 10nm LPP process.

While there are no details yet on when these SoCs will be unveiled, rumors point to MWC 2018 as the possible date for Qualcomm to formally introduce these SoCs.

 

Source: Phone Arena

 

Check out our Qualcomm articles on the site:

Qualcomm Introes QuickCharge 4+ Tech

Rumor: Snapdragon 855 in the Works

 

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